Ieee Transactions on Components and Packaging Technologies

IEEE Transactions on Components and Packaging Technologies publishes research and applications articles on the modeling, building blocks, technical infrastructure, and analysis underpinning electronic, photonic, MEMS and sensor packaging; new developments in passive and integrated components, electrical contacts and connectors, bonding,interconnection, device reliability and failure modes, and materials for electronics; thermal management, including thermomechanics, thermal measurement, cooling technology, and thermal phenomena in electronics.

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